Automotive parts的問題，透過圖書和論文來找解法和答案更準確安心。 我們找到下列各種有用的問答集和懶人包

Life Cycle Design & Engineering of Lightweight Multi-Material Automotive Body Parts: Results from the Bmbf Sponsored Collaborati

為了解決Automotive parts的問題，作者 這樣論述：

This book presents the final report of the collaborative research project MultiMaK2: MultiMaK2 contributed to the development of multi-material component concepts in large-scale automotive production. Whithin the project new methods in conceptual design of lightweight components were developed at

the example of roof cross member and transmission tunnels. A concurrent Life Cycle Design & Engineering approach led to identifying eco- and cost efficient component alternatives. This includes evaluation tools for the concepts’ full life cycle. Further, methods to integrate that knowledge into

automotive engineering processes have been established based on principles of visual analytics. That brings forward a tight integration of data, engineering models and results visualization towards an informed knowledge building across disciplines. MultiMaK2 also compiled and structured design guid

elines within a knowledge management system. All methods and tools have been embedded within the Life Cycle Design & Engineering Lab in the Open Hybrid LabFactory.

Automotive parts進入發燒排行的影片

以相圖工程優化銀、銦、銅共摻雜硒化錫之熱電性質

為了解決Automotive parts的問題，作者何孟圜 這樣論述：

熱電材料在熱電致冷與廢熱回收中有巨大的發展潛力，而熱電材料的轉換效率可由熱電優值(zT)判斷，根據公式zT = (S2σ/κ)T可算出合金之熱電優值，其中σ及S與電性有關，分別為電導係數與賽貝克係數，而κ是熱傳導係數。而SnSe為中溫型熱電材料，其晶體結構為斜方晶且具有異向性，在b軸與c軸方向具有較佳之電性，故在該方向具有較佳之熱電表現。根據以往文獻，不同製程會影響其熱電性質，其中又以長晶法所製作出的SnSe晶體具有最佳的熱電表現，熱電優值在923 K時能達到約2.62，顯示出SnSe本身具有良好的熱電發展潛力。因此本研究冀能透過摻雜，改善SnSe在低溫區間的熱電性質，使其在中低溫區亦具有熱

電發展潛力。本研究主要可分為三個部分: (一) 以布氏長晶法合成SnSe 單晶，及In、Cu摻雜之SnSe熱電合金；(二) 搭配實驗所建構之In-Sn-Se、Cu-Sn-Se之三元熱力學相圖資訊，輔助確認微量摻雜SnSe熱電合金之最佳組成區間，其中以合金Cu0.0025Sn0.9975Se具有最高的熱電優值，在室溫下較未摻雜之SnSe高出200 %，達到0.16，此結果有助於改善SnSe在低溫區間之熱電應用；(三) 進一步探討SnSe之異向性，並作為發展SnSe薄膜熱電材料之基石，本研究以In或Cu摻雜之SnSe晶體作為基材 (matrix)，在其表面濺鍍 (sputtering) Ag鍍層，

藉以觀察Ag/(In, Cu)-SnSe於電流輔助/觸發燒結 (electric current assisted/activated sintering)下之相互擴散反應，研究結果顯示，在In0.002Sn0.998Se及(Cu2Se)0.01(SnSe)0.99的合金組成中，其熱電性質會在Ag濺鍍及電流輔助後提升，可作為提升SnSe於低溫區熱電性質之方法。關鍵字:熱電材料、SnSe、In-Sn-Se三元相圖、布氏長晶法、濺鍍

Primer on Automotive Lightweighting Technologies

為了解決Automotive parts的問題，作者Echempati, Raghu 這樣論述：

Dr. Raghu Echempati, PI, is a full professor of Mechanical Engineering at Kettering University. He earned his Master’s and Ph.D. in Mechanical Engineering from the Indian Institute of Technology (India) and another Master’s in Engineering Management from Kettering University. He is a registered prof

essional engineer (P.E.). He was an active member of SME and a certified manufacturing engineer also granted by SME. He is an active member and a fellow of ASME, active member and McFarland awardee of SAE, and an active member of ASEE. He participated in several study abroad programs in Germany and

taught design and finite element analysis courses for several semesters in Germany and in India. He secured Fulbright award twice to teach in India and in Thailand. Since 2005, he has been one of the organizers of Body Design and Engineering session of SAE world congress. He is a panel member to rev

iew proposals submitted to NSF, Fulbright and Gilman Foundation (for study abroad). He has published over 130 journal and conference papers and supervised several undergraduate and graduate student theses in the areas of design, finite element analysis and manufacturing. His academic teaching, appli

ed research and consulting experience spans over 25 years. He taught several core and elective courses in the mechanics, design and manufacture areas, including sheet metal forming course that he developed and taught for many years. He published a few papers with his students on formability of alumi

num sheet metal parts. Dr. Echempati worked at GM and other industries as a aculty Intern to understand the better practices followed in bulk and sheet metal forming processes, primarily using steel and to some extent aluminum formed conventionally and by hydroforming operations.

無電電鍍銅以乙醛酸取代甲醛當作還原劑

為了解決Automotive parts的問題，作者邱德瑋 這樣論述：

如今環保法規的嚴格，造成無電電鍍產業上使用的還原劑甲醛受到管制，因此需要尋找替代的還原劑來取代甲醛還原劑，必須對環境無害且不受到環保規範的環境友善藥品。無電電鍍是在不施加電壓的情況下以自身催化氧化還原反應使金屬能夠在材料表面上形成一層金屬薄膜，此表面金屬工藝經常用於市面上經常看到的各個行業裡，例如：在布上進行鍍銅、在汽車塑膠零件上鍍上金屬薄膜增加美觀和在醫療器材上鍍上銅增加抗菌性。 本研究是要將甲醛還原劑用乙醛酸進行代替，乙醛酸為環境友善藥品，並未受到環保法規限制，條件也並未有太大的不同，因此適合用以替代甲醛。比較乙醛酸跟甲醛使用之差異。在實驗中是使用到了硫酸銅、EDTA螯合劑、50

%乙醛酸還原劑、2,2聯吡啶、黃血鹽等安定劑和利用氫氧化鈉進行pH值的調整。本次是以在布上進行無電電鍍銅來進行實驗，將布進行前處理再進行鍍銅，將無電電鍍完之布進行厚度、電阻和密著性測試來表明說鍍上之銅可以達到與使用甲醛還原劑相同的效果，也可以達到所需要的條件，可使用乙醛酸來代替甲醛當作無電電鍍主要的還原劑來使用，廢液處理方式跟原本的方法相同，但不需要額外負擔甲醛的處理費用和空汙費用。